Requirements for Soldered Electrical and Electronic Assemblies
standard by Association Connecting Electronics Industries, 09/01/2020

Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 2020

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
Amendment by Association Connecting Electronics Industries, 07/01/2016

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards
Amendment by Association Connecting Electronics Industries, 12/01/2018

Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2017

Qualification and Performance Specification for Rigid Printed Boards
standard by Association Connecting Electronics Industries, 04/01/2010

Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013

Design and Assembly Process Implementation for Bottom Termination Components
standard by Association Connecting Electronics Industries, 03/28/2011

Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2005

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 01/24/2020

Guideline on Flexibility and Stretchability Testing for Printed Electronics
standard by Association Connecting Electronics Industries, 02/01/2017