Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 02/01/2005
2000 Technology Trends for Printed Wiring Boards
Report / Survey by Association Connecting Electronics Industries, 01/01/2000
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
standard by Association Connecting Electronics Industries, 07/01/2001
Documentation Requirements for Printed Boards
standard by Association Connecting Electronics Industries, 05/01/1995
Design and End Product Requirements for Discrete Wiring Boards
standard by Association Connecting Electronics Industries, 05/01/1995
Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
standard by Association Connecting Electronics Industries, 08/01/2014
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
standard by Association Connecting Electronics Industries, 02/01/2003
Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016
IPC/SOLDERTEC International Conference on Lead Free Electronics "Towards Implementation of the RHS Directive" (Brussels, Belgium – June 2003)
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003